ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,980, issued on April 7, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Front end of line processing compatible ther... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,981, issued on April 7, was assigned to QUALCOMM Inc. (San Diego). "Port landing-free low-skew signal distribution with backside metallizat... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,982, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices with insulated source/... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,983, issued on April 7, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Interconnects formed using integrated damasc... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,984, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device including conductive st... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,985, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and for... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,986, issued on April 7, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Metal insulator metal capacitor (MIM capacit... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,987, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device" was invented by Seongh... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,988, issued on April 7, was assigned to SEIKO EPSON Corp. (Japan). "Integrated circuit device" was invented by Takanori Iwawaki (Suwa, Japa... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,989, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Package structures with patterned die backside layer" was inven... और पढ़ें